EPS student awarded Hammermen Scholarship

L-R: Professor Jim Ritchie, Daniel Jones, Professor John Simmons and Dr Stephen Houston

Every year, the Incorporation of The Hammermen of Edinburgh offers a travel scholarship to an outstanding undergraduate mechanical engineer, allowing a developing young professional to supplement their learning during their normal undergraduate programme. This year the recipient of this award is third Year MEng Student Daniel Jones.

The scholarship will be used to support some of Daniel's travel and subsistence costs on his 13 week IAESTE summer placement to Panama where he will work with the Compañía Climatizadora in Panama City. His work will involve carrying out design work and field trials on air conditioning and ventilation systems based on existing codes, and Daniel will give a presentation on his experience at the Incorporation's Annual Dinner in April 2015.

I am confident that this placement will greatly improve my employability and job prospects when applying for graduate jobs, as well as giving me the opportunity to experience a culture vastly different to the one I'm used to.

Daniel Jones

Professor James Ritchie, Dean of Science and Engineering said: "This work is highly relevant to Daniel's degree since it makes use of a combination of design and manufacture, thermodynamics and fluid mechanics, subjects he has studied over the last few years. This will provide him with a real opportunity to put into practice his theoretical knowledge gained through his mechanical engineering programme".

Daniel added: "I am confident that this placement will greatly improve my employability and job prospects when applying for graduate jobs, as well as giving me the opportunity to experience a culture vastly different to the one I'm used to".

The photograph shows Daniel after receiving his scholarship cheque from the Incorporation's Deacon Professor John Simmons and they are accompanied by Dr Stephen Houston, Academic Head of Mechanical Engineering, and Professor Jim Ritchie, Dean of Science and Engineering.